Liquid Cooling · Modular AI Data Center Infrastructure
首席技术官 CTO — PansPower | 合伙人 Partner — MDCX Chief Technology Officer — PansPower | Partner — MDCX
2026年7月起担任潘氏未来(PansPower)首席技术官,并任 MDCX 合伙人,负责液冷与浸没液冷模块化 AI 数据中心的技术路线、产品架构与工程落地。此前于 Fog Computing 主导同一产品线的研发与商业化。20余年经历覆盖微软核心客户技术管理与 AIoT 创业,擅长把产品定义、工程交付和规模化落地连成一条链路。 Since July 2026, Chief Technology Officer of PansPower and a Partner of MDCX, responsible for the technical roadmap, product architecture, and engineering delivery of liquid-cooled and immersion-cooled modular AI data centers. Previously led R&D and commercialization of the same product line at Fog Computing. Twenty-plus years across core-customer technical management at Microsoft and an AIoT venture, connecting product definition, engineering execution, and scaled delivery.
负责潘氏未来液冷与浸没液冷模块化 AI 数据中心的技术路线、产品架构与工程落地。作为 MDCX 合伙人,推动这些工厂预制模块以标准产品交付,并配套基础设施运营系统 CIOS。 Owns the technical roadmap, product architecture, and engineering delivery of PansPower’s liquid-cooled and immersion-cooled modular AI data centers. As a Partner of MDCX, takes those factory-built blocks to market as a standard product, with CIOS as the operations layer.
主导模块化AI基础设施平台的研发与商业化,涵盖浸没式液冷系统、直接液冷系统、模块化数据中心及基础设施管理软件。 Lead R&D and commercialization of a modular AI infrastructure platform — immersion liquid cooling, direct-to-chip liquid cooling, modular data centers, and infrastructure management software.